• DocumentCode
    1958036
  • Title

    Simulation of the novel micro-valve using dynamic analysis

  • Author

    Chung, C.K. ; Shih, T.R. ; Wu, B.R.

  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    527
  • Lastpage
    530
  • Abstract
    In this article, the 3D dynamic analysis was used to investigate the geometrical effect on the net flow rate of the novel microvalves in comparison with the conventional nozzle/diffuser microvalves. The novel microvalves with saw-tooth structures had been investigated by 3D transient simulations in order to study the transient flow behavior at different angles. Simulation parameters are half angle alpha, taper angle thetas and excitation frequency f. Simulate results show that net flow rate is dependent on the excitation frequencies. As excitation frequency is higher than 10 Hz, net flow rate decreases with increasing excitation frequency. Net flow rate can also increase with adding circular area and increasing half angle. Better half angle is found at alpha = 6deg. Compared to a conventional nozzle/diffuser microvalve, a novel microvalve with thetas = 9.7deg and alpha = 6deg have the higher net volume flow rate of 0.256 mul/s. Besides, as width of the throat increases, net flow rate will also increase. These results are beneficial for the design of micropumps.
  • Keywords
    microchannel flow; microfabrication; micropumps; microvalves; transient response; 3D dynamic analysis; 3D transient simulations; conventional nozzle-diffuser microvalve comparison; excitation frequency; microchannel; micropump design; net volume flow rate; saw-tooth structured microvalve design; transient flow behavior; Analytical models; Frequency; Gravity; Microchannel; Micropumps; Microvalves; Numerical simulation; Systems engineering and theory; Valves; Viscosity; diffuser; microvalve; nozzle;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068634
  • Filename
    5068634