DocumentCode
1960908
Title
Temperature compensated radio-frequency harmonic bulk acoustic resonators pressure sensors
Author
Baron, T. ; Lebrasseur, Eric ; Romand, J.P. ; Alzuaga, Sebastien ; Queste, S. ; Martin, G. ; Gachon, D. ; Laroche, T. ; Ballandras, S. ; Masson, Jean-Francois
Author_Institution
FEMTO-ST, Univ. de Franche-Comte, Besancon, France
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
2040
Lastpage
2043
Abstract
In this work, we propose a compensated temperature pressure sensor fabricated on compound LiNbO3/Quartz/Quartz substrates obtained by Au/Au bonding at room temperature and double face lapping/polishing of LiNbO3/Quartz stack and a final gold bonding with a structured Quartz wafer. This paper shows the possibility to obtain device which is intrinsically low sensitive to thermal effects, and even allowing a second order compensation thanks to the Quartz thermal stability Sensitivity of the final sensor to bending moments then is tested and results show pressure sensitivity of such devices.
Keywords
acoustic resonators; bulk acoustic wave devices; pressure sensors; quartz; temperature sensors; thermal stability; LiNbO3-SiO2; quartz thermal stability sensitivity; radio-frequency harmonic bulk acoustic resonators pressure sensors; structured Quartz wafer; temperature 293 K to 298 K; temperature sensors; thermal effects; Bonding; Lapping; Lithium niobate; Resonant frequency; Sensitivity; Temperature sensors; BAW; HBAR; Pressure Sensor; Temperature compensation;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location
San Diego, CA
ISSN
1948-5719
Print_ISBN
978-1-4577-0382-9
Type
conf
DOI
10.1109/ULTSYM.2010.5935869
Filename
5935869
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