• DocumentCode
    1960908
  • Title

    Temperature compensated radio-frequency harmonic bulk acoustic resonators pressure sensors

  • Author

    Baron, T. ; Lebrasseur, Eric ; Romand, J.P. ; Alzuaga, Sebastien ; Queste, S. ; Martin, G. ; Gachon, D. ; Laroche, T. ; Ballandras, S. ; Masson, Jean-Francois

  • Author_Institution
    FEMTO-ST, Univ. de Franche-Comte, Besancon, France
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    2040
  • Lastpage
    2043
  • Abstract
    In this work, we propose a compensated temperature pressure sensor fabricated on compound LiNbO3/Quartz/Quartz substrates obtained by Au/Au bonding at room temperature and double face lapping/polishing of LiNbO3/Quartz stack and a final gold bonding with a structured Quartz wafer. This paper shows the possibility to obtain device which is intrinsically low sensitive to thermal effects, and even allowing a second order compensation thanks to the Quartz thermal stability Sensitivity of the final sensor to bending moments then is tested and results show pressure sensitivity of such devices.
  • Keywords
    acoustic resonators; bulk acoustic wave devices; pressure sensors; quartz; temperature sensors; thermal stability; LiNbO3-SiO2; quartz thermal stability sensitivity; radio-frequency harmonic bulk acoustic resonators pressure sensors; structured Quartz wafer; temperature 293 K to 298 K; temperature sensors; thermal effects; Bonding; Lapping; Lithium niobate; Resonant frequency; Sensitivity; Temperature sensors; BAW; HBAR; Pressure Sensor; Temperature compensation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2010 IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-0382-9
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2010.5935869
  • Filename
    5935869