Effect of joint strength of PbSn and AuSn solders on thermal aging in laser packages

Author

Sheen, M.T. ; Chang, C.B. ; Teng, H.C. ; Kuang, J.H. ; Hsieh, K.C. ; Cheng, W.H.

Author_Institution

Inst. of Electro-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

Volume

2

fYear

2001

fDate

2001

Firstpage

435

Abstract

The effect of joint strength of PbSn and AuSn solders on thermal aging in laser packages has been studies experimentally and numerically. Samples were aged at 150°C for one, four, nine, sixteen, twenty-five, and thirty-six days. It was found that the joint strength decreased as the aging tune increased. This joint strength decreased may be due to the brittle fractures associated with void formation increased in solder joints. A finite-element method (FEM) simulation of joint strength was in reasonable agreement with the experimental measurements

Keywords

ageing; brittle fracture; finite element analysis; internal stresses; semiconductor device packaging; semiconductor lasers; soldering; thermal management (packaging); thermal stresses; voids (solid); 1 to 36 day; 150 C; AuSn; FEM simulation; PbSn; aging tune; brittle fractures; coupled thermal-elasticity-plasticity model; eutectic solders; laser assembly; laser diode chip; laser packages; laser-solder-submount assembly; relative void percentage; residual stress; shear stress; solder joint strength effect; solderability; solidification; thermal aging; void formation; Aging; Assembly; Diode lasers; Finite element methods; Gold; Laser theory; Lasers and electrooptics; Packaging; Soldering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE

Conference_Location

San Diego, CA

ISSN

1092-8081

Print_ISBN

0-7803-7105-4

Type

conf

DOI

10.1109/LEOS.2001.968859

Filename

968859