DocumentCode
1962993
Title
System technology challenges facing the PC industry
Author
Suarez-Gartner, Ricardo E.
Author_Institution
Intel Corp., Hillsboro, OR, USA
fYear
1998
fDate
2-4 Mar 1998
Firstpage
1
Lastpage
6
Abstract
Personal computers continue to achieve performance levels that exceed those exhibited by mainframes and minicomputers only a few years ago. As in the case of mainframes, these performance gains are coupled with significant increases in power dissipation, electromagnetic emissions, and tighter requirements for power delivery and high speed signaling. In contrast with big computers, however, PCs have very tight cost constraints and high volume manufacturability expectations. These requirements call for commoditized packaging approaches which render conventional solutions either unaffordable or inadequate. Therefore, the accelerating performance trends for microprocessors, chipsets, graphics, memory and other subsystems present a challenge to develop multidisciplinary packaging solutions in which universities could and should play a key role
Keywords
DP industry; electromagnetic interference; microcomputers; packaging; EMI containment; PC industry; chipsets; cost constraints; electromagnetic emission; graphics; high speed signaling; high volume manufacturability; memory; microprocessors; multidisciplinary packaging solutions; performance gains; personal computers; power delivery; power dissipation; system technology challenges; universities; Acceleration; Computer aided manufacturing; Costs; Electromagnetic coupling; Microcomputers; Packaging; Performance gain; Personal communication networks; Power dissipation; Rendering (computer graphics);
fLanguage
English
Publisher
ieee
Conference_Titel
Devices, Circuits and Systems, 1998. Proceedings of the 1998 Second IEEE International Caracas Conference on
Conference_Location
Isla de Margarita
Print_ISBN
0-7803-4434-0
Type
conf
DOI
10.1109/ICCDCS.1998.705699
Filename
705699
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