DocumentCode
1963622
Title
Effect of leadframe design on aluminum wire bonding
Author
Hong, Tan Joo ; Chua Kwee
Author_Institution
Infineon Technol. AP Pte Ltd., Singapore, Singapore
fYear
2003
fDate
16-18 July 2003
Firstpage
65
Lastpage
68
Abstract
Parameters such as Force, Power, Time, Clamping and Anvil block designs are important factors in obtaining a good aluminum wedge bond. Initially, the leadframe design has a fused lead connected to the die paddle. This connection of the lead to the die paddle causes ineffective clamping, resulting in lifted wedge bond after reliability stress. Moreover, the bonding is worsened by delamination at the leads, found after stress. In this study, investigations are done on the leadframe designs to determine the effectiveness of the clamping concept that lead to good bond integrity. Pull tests results showed that the wedge bonds bonded on Partial Cut leadframe (with narrow joint between the lead and die paddle) are slightly weaker as compared to those bonded on Full Cut leadframe (no joint between the lead and die paddle). Moreover, propagation of delamination is seen on the Partial Cut lead. This phenomenon is however, not observed on the Full Cut lead. Thus, further reliability stresses are performed on the Full Cut leadframe design to further check on the bond integrity. All units passed the reliability tests and the package is qualified as a Moisture Classification Level 3 package.
Keywords
aluminium; clamps; delamination; lead; lead bonding; mechanical testing; reliability; Pb-Al; aluminum wedge bond; aluminum wire bonding; anvil block designs; bond integrity; clamping force; delamination; die paddle; full cut leadframe; leadframe design; moisture classification level 3 package; partial cut leadframe; pull tests; reliability stress; reliability tests; Aluminum; Bonding forces; Clamps; Delamination; Moisture; Packaging; Stress; Temperature; Testing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
ISSN
1089-8190
Print_ISBN
0-7803-7933-0
Type
conf
DOI
10.1109/IEMT.2003.1225880
Filename
1225880
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