• DocumentCode
    1963622
  • Title

    Effect of leadframe design on aluminum wire bonding

  • Author

    Hong, Tan Joo ; Chua Kwee

  • Author_Institution
    Infineon Technol. AP Pte Ltd., Singapore, Singapore
  • fYear
    2003
  • fDate
    16-18 July 2003
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    Parameters such as Force, Power, Time, Clamping and Anvil block designs are important factors in obtaining a good aluminum wedge bond. Initially, the leadframe design has a fused lead connected to the die paddle. This connection of the lead to the die paddle causes ineffective clamping, resulting in lifted wedge bond after reliability stress. Moreover, the bonding is worsened by delamination at the leads, found after stress. In this study, investigations are done on the leadframe designs to determine the effectiveness of the clamping concept that lead to good bond integrity. Pull tests results showed that the wedge bonds bonded on Partial Cut leadframe (with narrow joint between the lead and die paddle) are slightly weaker as compared to those bonded on Full Cut leadframe (no joint between the lead and die paddle). Moreover, propagation of delamination is seen on the Partial Cut lead. This phenomenon is however, not observed on the Full Cut lead. Thus, further reliability stresses are performed on the Full Cut leadframe design to further check on the bond integrity. All units passed the reliability tests and the package is qualified as a Moisture Classification Level 3 package.
  • Keywords
    aluminium; clamps; delamination; lead; lead bonding; mechanical testing; reliability; Pb-Al; aluminum wedge bond; aluminum wire bonding; anvil block designs; bond integrity; clamping force; delamination; die paddle; full cut leadframe; leadframe design; moisture classification level 3 package; partial cut leadframe; pull tests; reliability stress; reliability tests; Aluminum; Bonding forces; Clamps; Delamination; Moisture; Packaging; Stress; Temperature; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
  • ISSN
    1089-8190
  • Print_ISBN
    0-7803-7933-0
  • Type

    conf

  • DOI
    10.1109/IEMT.2003.1225880
  • Filename
    1225880