• DocumentCode
    1964107
  • Title

    Validating and characterizing high speed datacom devices

  • Author

    Napier, Tom

  • Author_Institution
    NPTest, San Jose, CA, USA
  • fYear
    2003
  • fDate
    16-18 July 2003
  • Firstpage
    221
  • Lastpage
    224
  • Abstract
    ICs developed for data communications present a number of challenges in the development of test solutions to be used in validation, characterization, and high volume production. One of the most obvious challenges is the frequency and data rates at which these devices operate. The OC-48 standard in use today transmits and receives data at 2.5 Gbps. Emerging standards of "Xaui" and "OC-192" operate at 3.2 Gbps and 9.6 Gbps respectively, which provide even greater challenges. The majority of ATE today operates at ≪1 Gbps. A few ATE companies have announced solutions that will be able to provide at 3.2 Gbps, but these solutions are hard to find. Other challenges are jitter requirements as low as 5pS, non-deterministic data delays in the devices, signal pin counts above 500 pins, and low voltage differential swings. This paper looks at these challenges and solutions. The results from OC-48, Xaui, and OC-192 projects developed by NPTest SABER will be presented. These solutions use a combination of ATE, external instrumentation, custom interfacing, and software. The paper will also look at tradeoffs in these solutions.
  • Keywords
    automatic test equipment; built-in self test; data communication; digital communication; instrumentation; integrated circuit testing; jitter; semiconductor devices; 2.5 Gbit/s; 3.2 Gbit/s; 9.6 Gbit/s; ATE; OC-192; OC-48; custom interfacing; data communications; data rates; external instrumentation; high speed datacom devices; high volume production; jitter requirements; low voltage differential swings; nondeterministic data delays; test solutions development; Data communication; Delay; Frequency; Jitter; Low voltage; Pins; Production; Synchronization; Testing; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International
  • ISSN
    1089-8190
  • Print_ISBN
    0-7803-7933-0
  • Type

    conf

  • DOI
    10.1109/IEMT.2003.1225904
  • Filename
    1225904