• DocumentCode
    1966601
  • Title

    Performance, metastability and soft-error robustness tradeoffs for flip-flops in 40nm CMOS

  • Author

    Rennie, David ; Li, David ; Sachdev, Manoj ; Bhuva, Bharat ; Jagannathan, Srikanth ; Wen, ShiJie ; Wong, Rick

  • Author_Institution
    Univ. of Waterloo, Waterloo, ON, Canada
  • fYear
    2011
  • fDate
    19-21 Sept. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In modern CMOS processes there are numerous failure mechanisms, including soft errors and metastability. Cosmic neutron-induced single event upsets, or soft-errors, have become a dominant failure mechanism in sub-100nm CMOS memory and logic circuits. The effects of metastability have also becoming increasingly significant in high-speed applications implemented in nanometric processes. In this paper the design tradeoffs for flip-flops between performance, soft-error robustness and metastability are described. Soft-error robust flip-flops are implemented based on both the DICE cell and the Quatro cell. SPICE simulations are used to characterize the performance and metastability robustness. The flip-flops were fabricated in the TSMC 40nm process and radiation measurements were performed at numerous test facilities. The Quatro flip-flop showed improved soft-error robustness and metastability when compared with both a reference flip-flop and a DICE flip-flop.
  • Keywords
    CMOS digital integrated circuits; failure analysis; flip-flops; logic circuits; CMOS memory; DICE cell; Quatro cell; TSMC process; cosmic neutron-induced single event upsets; failure mechanism; flip-flops; high-speed applications; logic circuits; metastability; nanometric processes; radiation measurements; reference flip-flop; size 100 nm; size 40 nm; soft-error robustness tradeoffs; Delay; Flip-flops; Latches; Logic gates; Neutrons; Robustness; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2011 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4577-0222-8
  • Type

    conf

  • DOI
    10.1109/CICC.2011.6055415
  • Filename
    6055415