Low-cost 60 GHz-band antenna-integrated transmitter/receiver modules utilizing multi-layer low-temperature co-fired ceramic technology

Author

Maruhashi, K. ; Ito, M. ; Desclos, L. ; Ikuina, K. ; Senba, N. ; Takahashi, N. ; Ohata, K.

Author_Institution

Kansai Electron. Res. Labs., NEC Corp., Shiga, Japan

fYear

2000

fDate

9-9 Feb. 2000

Firstpage

324

Lastpage

325

Abstract

These millimeter-wave multi-chip modules (MCMs) carry MMICs flip-chip mounted on a low-temperature co-fired ceramic (LTCC) substrate with an integrated antenna. The LTCC technology combining thick film printing technique is widely used for low-cost, high-volume applications, but is limited to a low-frequency operation <30 GHz. This is due mainly to relatively high dielectric loss and low pattern resolution. To overcome these difficulties and to realize low-cost MCMs, the MCM includes several new concepts.

Keywords

MMIC; ceramics; flip-chip devices; millimetre wave antennas; multichip modules; receiving antennas; transmitting antennas; 60 GHz; LTCC substrate; flip-chip MMIC; integrated transmitter/receiver module; millimeter-wave antenna; multi-chip module; multilayer low-temperature co-fired ceramic technology; Ceramics; Dielectric losses; Dielectric substrates; MMICs; Millimeter wave technology; Printing; Receiving antennas; Thick films; Transmitters; Transmitting antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International

Conference_Location

San Francisco, CA, USA

ISSN

0193-6530

Print_ISBN

0-7803-5853-8

Type

conf

DOI

10.1109/ISSCC.2000.839800

Filename

839800