• DocumentCode
    1968961
  • Title

    Packaging and power distribution design considerations for a Sun Microsystems desktop workstation

  • Author

    Smith, Larry D.

  • Author_Institution
    Sun Microsyst., Mountain View, CA, USA
  • fYear
    1997
  • fDate
    27-29 Oct. 1997
  • Firstpage
    19
  • Lastpage
    22
  • Abstract
    The power distribution system will become an increasingly important package design consideration for computer systems such as the Sun Microsystems desktop workstation, at least as important as simultaneous switch. Power distribution impedance is controlled by the switching power supply, bulk capacitance, ceramic capacitance and power plane properties at various portions of the frequency spectrum. A major concern with package power is resonance between chip capacitance and package inductance. The key parameters for package power are the core power supply loop inductance and the inductance and resistance used to connect any decoupling capacitors on the package. Decoupling capacitors on the package can be used but they will not be effective unless the connections to them are specially designed using aggressive technologies.
  • Keywords
    computer power supplies; packaging; workstations; Sun Microsystems desktop workstation; bulk capacitance; ceramic capacitance; chip capacitance; computer system; core power supply loop inductance; decoupling capacitor; packaging; power distribution design; resistance; resonance; switching power supply; Capacitance; Capacitors; Distributed computing; Inductance; Packaging; Power distribution; Power supplies; Sun; Switches; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    0-7803-8649-3
  • Type

    conf

  • DOI
    10.1109/EPEP.1997.634028
  • Filename
    634028