DocumentCode
1968961
Title
Packaging and power distribution design considerations for a Sun Microsystems desktop workstation
Author
Smith, Larry D.
Author_Institution
Sun Microsyst., Mountain View, CA, USA
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
19
Lastpage
22
Abstract
The power distribution system will become an increasingly important package design consideration for computer systems such as the Sun Microsystems desktop workstation, at least as important as simultaneous switch. Power distribution impedance is controlled by the switching power supply, bulk capacitance, ceramic capacitance and power plane properties at various portions of the frequency spectrum. A major concern with package power is resonance between chip capacitance and package inductance. The key parameters for package power are the core power supply loop inductance and the inductance and resistance used to connect any decoupling capacitors on the package. Decoupling capacitors on the package can be used but they will not be effective unless the connections to them are specially designed using aggressive technologies.
Keywords
computer power supplies; packaging; workstations; Sun Microsystems desktop workstation; bulk capacitance; ceramic capacitance; chip capacitance; computer system; core power supply loop inductance; decoupling capacitor; packaging; power distribution design; resistance; resonance; switching power supply; Capacitance; Capacitors; Distributed computing; Inductance; Packaging; Power distribution; Power supplies; Sun; Switches; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634028
Filename
634028
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