• DocumentCode
    1972959
  • Title

    Deformation of octahedron slotted metal tracks

  • Author

    Kludt, J. ; Weide-Zaage, K. ; Ackermann, Mathieu ; Hein, V.

  • Author_Institution
    Inf. Technol. Lab., Gottfried Wilhelm Leibniz Univ. Hannover, Hannover, Germany
  • fYear
    2013
  • fDate
    13-17 Oct. 2013
  • Firstpage
    161
  • Lastpage
    165
  • Abstract
    The advantage of an increased lifetime of slotted metal tracks for the use in integrated circuits has already been shown. A benefit for slotted metal track geometries especially for thick metal tracks under DC and DC pulsed stress test conditions could be confirmed by lifetime measurements. To achieve a higher current capability these metal tracks, also known as “power metals”, were used in upper metallization layers. This new design concept shows a better robustness towards electromigration in comparison to conventional wide unslotted metal tracks. A new concept deals with the use of slotted geometries in lower metallization layers. Simulations show a decrease of von Mises stress in comparison to unslotted metal tracks. This behaviour can reduce the current shift of active and passive devices due to the imposed stress of the lower metallization layers.
  • Keywords
    deformation; electromigration; integrated circuit metallisation; integrated circuit reliability; metals; deformation; electromigration; integrated circuits; octahedron slotted metal tracks; power metals; slotted geometries; upper metallization layers; von Mises stress; Aluminum; Dielectrics; Geometry; Metallization; Stress; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4799-0350-4
  • Type

    conf

  • DOI
    10.1109/IIRW.2013.6804184
  • Filename
    6804184