DocumentCode
1972959
Title
Deformation of octahedron slotted metal tracks
Author
Kludt, J. ; Weide-Zaage, K. ; Ackermann, Mathieu ; Hein, V.
Author_Institution
Inf. Technol. Lab., Gottfried Wilhelm Leibniz Univ. Hannover, Hannover, Germany
fYear
2013
fDate
13-17 Oct. 2013
Firstpage
161
Lastpage
165
Abstract
The advantage of an increased lifetime of slotted metal tracks for the use in integrated circuits has already been shown. A benefit for slotted metal track geometries especially for thick metal tracks under DC and DC pulsed stress test conditions could be confirmed by lifetime measurements. To achieve a higher current capability these metal tracks, also known as “power metals”, were used in upper metallization layers. This new design concept shows a better robustness towards electromigration in comparison to conventional wide unslotted metal tracks. A new concept deals with the use of slotted geometries in lower metallization layers. Simulations show a decrease of von Mises stress in comparison to unslotted metal tracks. This behaviour can reduce the current shift of active and passive devices due to the imposed stress of the lower metallization layers.
Keywords
deformation; electromigration; integrated circuit metallisation; integrated circuit reliability; metals; deformation; electromigration; integrated circuits; octahedron slotted metal tracks; power metals; slotted geometries; upper metallization layers; von Mises stress; Aluminum; Dielectrics; Geometry; Metallization; Stress; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2013 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4799-0350-4
Type
conf
DOI
10.1109/IIRW.2013.6804184
Filename
6804184
Link To Document