DocumentCode
1973062
Title
Processing Requirements for Mass Production of Microwave Hybrid Integrated Circuits
Author
Fache, M. ; Joly, J.
Author_Institution
LIGNES TELEGRAPHIQUES & TELEPHONIQUES - Microwave Department - B.P. No 5 - 78702 - CONFLANS SAINTE HONORINE - France
fYear
1978
fDate
4-8 Sept. 1978
Firstpage
368
Lastpage
373
Abstract
The works undertaken by L.T.T. to master the different operations for low cost and mass production of MIC (in TO 8 package) components are described. A certain number of devices representative of the whole of microwave components one can realize in MIC technology were selected. They were used both for a comparative study of the explored technologies (from both technical and economical points of view) and for systematic reliability and reproductibility tests. The most performing technologies will be described in detail.
Keywords
Bonding; Costs; Hybrid integrated circuits; Integrated circuit technology; Mass production; Microwave devices; Microwave integrated circuits; Microwave technology; Sputtering; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 1978. 8th European
Conference_Location
Paris, France
Type
conf
DOI
10.1109/EUMA.1978.332577
Filename
4131231
Link To Document