Thermal Characterization and Simulation of Packaged Medium Power Amplifier

Author

Chaturvedi, Sandeep ; Koul, Shiban K. ; Saravanan, G. Sai

Author_Institution

Gallium Arsenide Enabling Technol. Centre, Hyderabad

fYear

2007

fDate

11-14 Dec. 2007

Firstpage

1

Lastpage

4

Abstract

Heat management is a key issue in packaged Microwave active devices and circuits. Estimating the amount of heat generated in the packaged device is important in order to work out a suitable scheme for thermal management. This paper presents thermal characterization of a packaged medium power amplifier (Pd~1.8 W) working in C-Band. Junction temperature of the MMICs inside the package has been estimated using simple heat flow concepts. The measured results have been validated by thermal simulation of the packaged MPA with a commercial CFD simulator. Simulated and measured results are within 3-5% showing effectiveness of the calculations.

Keywords

MMIC; power amplifiers; thermal management (packaging); heat management; junction temperature; packaged medium power amplifier; thermal characterization; Circuit simulation; Computational fluid dynamics; Electromagnetic heating; MMICs; Microwave circuits; Microwave devices; Packaging; Power amplifiers; Temperature; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2007. APMC 2007. Asia-Pacific

Conference_Location

Bangkok

Print_ISBN

978-1-4244-0748-4

Electronic_ISBN

978-1-4244-0749-1

Type

conf

DOI

10.1109/APMC.2007.4554947

Filename

4554947