DocumentCode
1980416
Title
Improved aging results using thick-film hybrid packaging and evacuated miniature ovenized oscillators using such packaging
Author
Clark, R.L. ; Li, J. ; Adler, J.
Author_Institution
Vectron Int., Norwalk, CT, USA
Volume
1
fYear
1999
fDate
1999
Firstpage
420
Abstract
Aging performance using hybrid thick-film packaging of oscillator assemblies comparable to individually packaged resonator assemblies is described in this paper. Achieving this level of aging performance has allowed for the practical realization of evacuated open-blank ovenized oscillators
Keywords
ageing; crystal oscillators; packaging; aging; evacuated miniature ovenized oscillators; evacuated open-blank oscillators; thick-film hybrid packaging; Aging; Assembly; Ceramics; Conducting materials; Electronic packaging thermal management; Electronics packaging; Insulation; Oscillators; Thermal conductivity; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location
Besancon
ISSN
1075-6787
Print_ISBN
0-7803-5400-1
Type
conf
DOI
10.1109/FREQ.1999.840796
Filename
840796
Link To Document