• DocumentCode
    19851
  • Title

    A Mircostrip Circuit Tool Kit App with FDTD Analysis Including Lumped Elements

  • Author

    Zaifeng Yang ; Eng Leong Tan

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    16
  • Issue
    1
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    74
  • Lastpage
    80
  • Abstract
    At the 2014 IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium (IMS2014), the Apps for MTT Student Design Contest was held,sponsored by the Microwave Field Theory (MTT-15) Technical Committee. One objective of the design contest is to take advantage of the growing computing capacity of smart handheld and mobile devices to promote their use for the computer-aided analysis and design of microwave components and circuits. With the rapid development of recent iOS and Android smart phones or pads, some advanced scientific computation programs can now be executed on these portable devices. These handy devices can also deal with microwave circuit calculations if the applications (apps) are well designed. Since these devices are always accessible, it may be more convenient for engineers and students to analyze and design microwave circuits on the phones or pads directly. Note that full-wave, three-dimensional (3-D) simulations for complicated microwave circuits usually require a large amount of memory and a central processing unit with high performance, so it may be difficult to run full-wave 3-D simulations on portable smart devices.
  • Keywords
    integrated circuit design; microstrip circuits; microwave circuits; smart phones; FDTD analysis; computer-aided analysis and design; computing capacity; handy devices; lumped elements; microstrip circuit tool kit app; microwave circuits; microwave components; mobile devices; smart handheld devices; Finite difference methods; Impedance; Microstrip; Microwave circuits; Microwave devices; Time-domain analysis;
  • fLanguage
    English
  • Journal_Title
    Microwave Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1527-3342
  • Type

    jour

  • DOI
    10.1109/MMM.2014.2367859
  • Filename
    7010373