Reduced temperature flip-chip technologies on flexible display substrates using adhesives

Author

Vanfleteren, Jan ; Vandecasteele, Bjorn ; Raevens, Steven ; Maattanen, Jarmo ; Perttula, Pasi

Author_Institution

Imec/Intec/TFCG, Gent, Belgium

fYear

2002

fDate

2002

Firstpage

92

Lastpage

95

Abstract

The paper investigates the possibilities to flip-chip assemble Si driver chips onto a flexible display, which is to be integrated in a smart card. The chips are Au or Ni/Au bumped, the substrate material consists of PES (polyether sulphone) with conductive ITO pads. One technology, using ICA and NCA seems to be quite straightforward, another, using ACA, reveals the problem of ITO damage during thermocompression.

Keywords

adhesives; contact resistance; driver circuits; flip-chip devices; interconnections; smart cards; substrates; surface mount technology; anisotropic conductive adhesives; conductive pads; driver chips; flexible display substrates; isotropic conductive adhesives; mounting process; nonconductive adhesives; passive interconnection test chips; polyether sulphone; reduced temperature flip-chip technologies; smart card; thermocompression; Assembly; Bonding; Conducting materials; Electric variables measurement; Electrical resistance measurement; Gold; Liquid crystal displays; Smart cards; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on

Print_ISBN

0-7803-7567-X

Type

conf

DOI

10.1109/POLYTR.2002.1020189

Filename

1020189