DocumentCode
1989848
Title
Realization of an Integrated Planar LC Low-Pass Filter with Modified Surface Micromachining Technology
Author
Fang, J. ; Liu, Z.W. ; Chen, Z.M. ; Liu, L.T. ; Li, Z.J.
Author_Institution
Institute of Microelectronics, Tsinghua University, Beijing, China. Email: fangjie99@mails.tsinghua.edu.cn
fYear
2005
fDate
19-21 Dec. 2005
Firstpage
729
Lastpage
732
Abstract
An Integrated Planar LC LPF(Low-Pass Filter) is designed and fabricated with Modified Surface Micromachining. The LPF is accomplished on low-resistance silicon substrate. To increase the performance of the filter, the substrate underneath the devices is modified with OPS (oxided porous silicon) technology. Measurement results give -3dB bandwidth of 2.925GHz and midband insertion loss of 0.874dB at 500MHz.
Keywords
LC filter; MEMS; OPS; RF; Circuit simulation; Dielectric substrates; Inductors; Low pass filters; MIM capacitors; Micromachining; Parasitic capacitance; Radio frequency; Silicon; Surface acoustic waves; LC filter; MEMS; OPS; RF;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2005 IEEE Conference on
Print_ISBN
0-7803-9339-2
Type
conf
DOI
10.1109/EDSSC.2005.1635379
Filename
1635379
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