Practical applications of 2-D optical proximity corrections for enhanced performance of 0.25 /spl mu/m random logic devices

Simplified 2-D Optical Proximity Correction (OPC) algorithms have been devised, calibrated and implemented on a state-of-the-art 0.25 /spl mu/m random logic process in order to reduce metal line pullback on critical layers. The techniques used are rules-based, but are characterized by fast and robust data conversion algorithms, calibrations based on actual process data, and inspectability of the resultant OPC corrected reticles. Application to local interconnect and metal patterning has corrected fundamental yield-limiting mechanisms in these levels.