DocumentCode
1997387
Title
Practical SIMD Vectorization Techniques for Intel® Xeon Phi Coprocessors
Author
Xinmin Tian ; Saito, Hiroshi ; Preis, Serguei V. ; Garcia, Eric N. ; Kozhukhov, Sergey S. ; Masten, Michael K. ; Cherkasov, Aleksei G. ; Panchenko, Nikolay
Author_Institution
Mobile Comput. & Compilers Software & Service Group, Intel Corp., Santa Clara, CA, USA
fYear
2013
fDate
20-24 May 2013
Firstpage
1149
Lastpage
1158
Abstract
Intel® Xeon Phi coprocessor is based on the Intel® Many Integrated Core (Intel® MIC) architecture, which is an innovative new processor architecture that combines abundant thread parallelism with long SIMD vector units. Efficiently exploiting SIMD vector units is one of the most important aspects in achieving high performance of the application code running on Intel® Xeon Phi coprocessors. In this paper, we present several practical SIMD vectorization techniques such as less-than-full-vector loop vectorization, Intel® MIC specific alignment optimization, and small matrix transpose/multiplication 2-D vectorization implemented in the Intel® C/C++ and Fortran production compilers for Intel® Xeon Phi coprocessors. A set of workloads from several application domains is employed to conduct the performance study of our SIMD vectorization techniques. The performance results show that we achieved up to 12.5x performance gain on the Intel® Xeon Phi coprocessor.
Keywords
FORTRAN; coprocessors; optimisation; parallel architectures; Fortran production compilers; Intel Many Integrated Core architecture; Intel Xeon Phi coprocessors; SIMD vectorization techniques; innovative new processor architecture; small matrix transpose-multiplication 2-D vectorization; Computer architecture; Coprocessors; Microwave integrated circuits; Optimization; Parallel processing; Registers; Vectors; Intel® MIC Architecture; Intel® Xeon Phi coprocessor; SIMD vectorization; compiler optimization;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel and Distributed Processing Symposium Workshops & PhD Forum (IPDPSW), 2013 IEEE 27th International
Conference_Location
Cambridge, MA
Print_ISBN
978-0-7695-4979-8
Type
conf
DOI
10.1109/IPDPSW.2013.245
Filename
6651001
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