Design and implementation of RF subsystems with multiple embedded passives in multi-layer organic substrates

Recent development in the design of high-Q passives embedded in low cost IC packages has made single-package integration of RF front-ends feasible. This paper analyses the effects of ground return in the performance of active circuits, while using multiple embedded devices in the package. The return-current path layout has been modeled using both electromagnetic field solvers as well as a circuit-based modeling methodology based on coupled line theory. Low noise amplifiers (LNAs) using discrete and embedded components have been designed and fabricated as test vehicles, and the modeled results have been verified with measurements.