A 0.08-cc fully integrated LTCC transceiver front-end module for 5-GHz wireless LAN systems

Author

Kunihiro, K. ; Yamanouchi, S. ; Dodo, H. ; Miyazaki, T. ; Hayama, N. ; Fujii, Masahiro ; Aoki, Y. ; Takahashi, Y. ; Numata, K. ; Haraguchi, Kazuya ; Ohtsuka, T. ; Ikuina, K. ; Hida, H.

Author_Institution

Photonic & Wireless Devices Res. Labs, NEC Corp., Ibaraki, Japan

fYear

2003

fDate

10-13 Aug. 2003

Firstpage

357

Lastpage

360

Abstract

An extremely compact transceiver (TRx) front-end module (FEM) has been developed for 5-GHz wireless LAN systems. A highly-integrated flip-chip TRx IC and the embedding of passive devices in a low-temperature co-fired ceramic (LTCC) with high ε_r(=17) are the keys to reducing the module size to 8 × 10 × 1 mm (0.08 cc). To the best of our knowledge, this is the most compact existing FEM that demonstrates full transceiver operation and complies with the IEEE 802.11a standard.

Keywords

ceramics; finite element analysis; flip-chip devices; radiofrequency integrated circuits; transceivers; wireless LAN; 5 GHz; IEEE 802.11a standard; OFDM; extremely compact transceiver; front-end module; highly-integrated flip-chip; local area network; low-temperature cofired ceramic; orthogonal frequency division multiplexing; passive devices; wireless LAN systems; Band pass filters; Ceramics; Costs; Low-noise amplifiers; National electric code; OFDM; Radio frequency; Switches; Transceivers; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 2003. RAWCON '03. Proceedings

Print_ISBN

0-7803-7829-6

Type

conf

DOI

10.1109/RAWCON.2003.1227966

Filename

1227966