• DocumentCode
    2004190
  • Title

    Comparison of rheological, thermal and electrical properties of poly(ethylene oxide) composites with micro and nano sized silicon dioxide filler

  • Author

    Reading, Martin ; Vaughan, Alun S.

  • Author_Institution
    ECS Dept., Univ. of Southampton, Southampton, UK
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Polyethylene oxide (PEO) is a water-soluble polymer often used as a model system to observe filler effects. This paper details an investigation into the physical, thermal and electrical properties of polyethylene oxide composites containing micro-(SD) and nano-silicon dioxide (nSD) filler. Three molecular weight host PEOs were used - 100,000 g mol-1, 400,000 g mol-1 and 1,000,000 g mol-1 and the SD was dispersed into the PEO in solution in distilled water, by using controlled shear conditions, and the properties of the resulting materials then studied. Dispersion of the micro- and nano- sized fillers was analysed during the solution rheology phase by means of shear rate - shear stress data collection. The crystallisation and melting behaviour were examined using differenial scanning calorimetry. The AC ramp electrical breakdown strength was also analysed. This paper investigates the effect of SD filler loading and shear history on structural evolution, electrical breakdown behaviour in PEO, and the dependence on filler size.
  • Keywords
    composite materials; differential scanning calorimetry; electric breakdown; electric properties; filler metals; rheology; thermal properties; AC ramp electrical breakdown strength; crystallisation-melting behaviour; differential scanning calorimetry; nanosized silicon dioxide filler; polyethylene oxide composites; shear rate - shear stress data collection; thermal-electrical properties; water-soluble polymer; Dispersion; Electric breakdown; Loading; Polymers; Silicon compounds; Viscosity; AC electrical breakdown; Polyethylene oxide; differential scanning calorimetry; polymer nanocomposites; rheology; silicon dioxide filler;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5568101
  • Filename
    5568101