• DocumentCode
    2006005
  • Title

    The impact of different alkali ion concentrated hollow glass microspheres on the electrical breakdown mechanism of syntactic foam

  • Author

    Mashkin, Andrey ; Strauchs, Anja ; Schnettler, Armin ; Lunding, Arne

  • Author_Institution
    Inst. for High Voltage Technol., RWTH Aachen Univ., Aachen, Germany
  • fYear
    2010
  • fDate
    4-9 July 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper deals with the experimental investigation on syntactic foam, a new composite insulation material consisting of an epoxy resin matrix filled with hollow glass microspheres. The investigations carried out focus on the impact of the glass composition of the microspheres on the dc breakdown field strength of syntactic foam. Two different breakdown test procedures are used to analyze the breakdown process. The breakdown properties of syntactic foam with microspheres with low alkali ion concentration depend on the breakdown step test procedure used, whereas for syntactic foam with microspheres of high alkali ion concentration no dependency on step test procedure is observed. The determined behavior is ascribed to the microscopic field distribution of syntactic foam, which depends on the alkali ion concentration of the hollow glass microspheres.
  • Keywords
    composite materials; electric breakdown; epoxy insulation; foams; insulating materials; alkali ion concentrated hollow glass microspheres; composite insulation material; dc breakdown field strength; electrical breakdown mechanism; epoxy resin matrix; syntactic foam; Conductivity; Electric breakdown; Epoxy resins; Glass; Stress; Syntactics; alkali ion; breakdown field strength; composite material; hollow microspheres; syntactic foam;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on
  • Conference_Location
    Potsdam
  • Print_ISBN
    978-1-4244-7945-0
  • Electronic_ISBN
    978-1-4244-7943-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2010.5568223
  • Filename
    5568223