• DocumentCode
    2006285
  • Title

    Research on failure analysis method of the key components in SMPS

  • Author

    Lifeng, Wu ; Shihong, Zhou ; Yinyu, Du ; Yong, Guan ; Wei, Pan

  • Author_Institution
    Highly Reliable Embedded Syst. Lab., Capital Normal Univ., Beijing, China
  • fYear
    2011
  • fDate
    24-25 May 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Electronic equipments propose the higher requirements for the performance and reliability of SMPS because of its continuous development. In the core components of SMPS, MOSFET and aluminum electrolytic capacitor are the key components that affect its reliability, and they have a higher failure and degradation rates among all of the components. Therefore, it is important to have a failure analysis for MOSFET and aluminum electrolytic capacitor. This paper mainly describes the failure analysis of MOSFET and aluminum electrolytic capacitor by the means of stress analysis method and parameter analysis method. The mean of stress analysis method is to monitor the main stresses that cause the components degradation failure, while the parameter analysis method is to monitor the change of the components main parameters that can reflect the components degradation state. However, both methods have their application limitations.
  • Keywords
    MOSFET; aluminium; electrolytic capacitors; failure analysis; reliability; stress analysis; switched mode power supplies; Al; MOSFET; SMPS; degradation failure analysis method; electrolytic capacitor; parameter analysis method; reliability; stress analysis method; switch mode power supply; Aluminum; Capacitors; Chemicals; Electric breakdown; MOSFET circuits; Stress; Aluminum Electrolytic Capacitor; MOSFET; Parameter Analysis Method; Stress Analysis Method; Switch Mode Power Supply;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Prognostics and System Health Management Conference (PHM-Shenzhen), 2011
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-7951-1
  • Electronic_ISBN
    978-1-4244-7949-8
  • Type

    conf

  • DOI
    10.1109/PHM.2011.5939540
  • Filename
    5939540