DocumentCode
2007559
Title
Polarization switching antenna integrated with RF MEMS switches using silicon-on-quartz and BCB packaging platform
Author
Hyeon, Ik-Jae ; Chung, Jinwoo ; Lim, Sungjoon ; Kim, Jong-Man ; Baek, Chang-Wook
Author_Institution
Chung-Ang Univ., Seoul, South Korea
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
755
Lastpage
758
Abstract
This paper reports a polarization switching antenna integrated with RF MEMS switches based on the novel packaging platform using silicon-on-quartz (SoQ) substrate and BCB(benzocyclobutene) bonding technique. By using the SoQ wafer as an antenna substrate as well as for a packaging lid, fabrication complexity and degradation of RF performances of the antenna due to the parasitic effects coming from the packaging method can be reduced. A fully-packaged K-band antenna capable of switching between two linear polarization states by actuating integrated silicon MEMS switches has been successfully fabricated. Performances of the antenna have been simulated and experimentally evaluated.
Keywords
antennas; electromagnetic wave polarisation; integrated circuit bonding; microswitches; packaging; BCB packaging platform; RF MEMS switches; RF performance degradation; SoQ wafer; benzocyclobutene bonding technique; fabrication complexity; fully-packaged K-band antenna; integrated silicon MEMS switches; linear polarization states; packaging lid; polarization switching antenna; silicon-on-quartz substrate; Degradation; Fabrication; K-band; Packaging; Polarization; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Switches; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442298
Filename
5442298
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