DocumentCode
2008383
Title
Multilevel routing with jumper insertion for antenna avoidance
Author
Ho, Tsung-Yi ; Chang, Yao-Wen ; Chen, Sao-Jie
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
63
Lastpage
66
Abstract
As technology advances into nanometer territory, the antenna problem has caused significant impact on routing tools. The antenna effect is a phenomenon of plasma-induced gate oxide degradation caused by charge accumulation on conductors. It directly influences reliability, manufacturability and yield of VLSI circuits, especially in deep-submicron technology using high density plasma. Furthermore, the continuous increase of the problem size of IC routing is also a great challenge to existing routing algorithms. In this paper, we propose a framework for multilevel full-chip routing with antenna avoidance using built-in jumper insertion approach. Compared with the state-of-the-art multilevel routing, the experimental results show that our approach reduced 100% antenna-violated gates and results in fewer wirelength, vias, and delay increase.
Keywords
VLSI; antennas; integrated circuit layout; integrated circuit manufacture; integrated circuit reliability; integrated circuit yield; network routing; IC routing; VLSI circuits; antenna avoidance; charge accumulation; deep-submicron technology; full-chip routing; high density plasma; jumper insertion; multilevel routing; plasma-induced gate oxide degradation; Degradation; Diodes; Fabrication; Integrated circuit interconnections; Manufacturing; Plasma density; Plasma materials processing; Reliability engineering; Routing; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
SOC Conference, 2004. Proceedings. IEEE International
Print_ISBN
0-7803-8445-8
Type
conf
DOI
10.1109/SOCC.2004.1362351
Filename
1362351
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