• DocumentCode
    2008383
  • Title

    Multilevel routing with jumper insertion for antenna avoidance

  • Author

    Ho, Tsung-Yi ; Chang, Yao-Wen ; Chen, Sao-Jie

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2004
  • fDate
    12-15 Sept. 2004
  • Firstpage
    63
  • Lastpage
    66
  • Abstract
    As technology advances into nanometer territory, the antenna problem has caused significant impact on routing tools. The antenna effect is a phenomenon of plasma-induced gate oxide degradation caused by charge accumulation on conductors. It directly influences reliability, manufacturability and yield of VLSI circuits, especially in deep-submicron technology using high density plasma. Furthermore, the continuous increase of the problem size of IC routing is also a great challenge to existing routing algorithms. In this paper, we propose a framework for multilevel full-chip routing with antenna avoidance using built-in jumper insertion approach. Compared with the state-of-the-art multilevel routing, the experimental results show that our approach reduced 100% antenna-violated gates and results in fewer wirelength, vias, and delay increase.
  • Keywords
    VLSI; antennas; integrated circuit layout; integrated circuit manufacture; integrated circuit reliability; integrated circuit yield; network routing; IC routing; VLSI circuits; antenna avoidance; charge accumulation; deep-submicron technology; full-chip routing; high density plasma; jumper insertion; multilevel routing; plasma-induced gate oxide degradation; Degradation; Diodes; Fabrication; Integrated circuit interconnections; Manufacturing; Plasma density; Plasma materials processing; Reliability engineering; Routing; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2004. Proceedings. IEEE International
  • Print_ISBN
    0-7803-8445-8
  • Type

    conf

  • DOI
    10.1109/SOCC.2004.1362351
  • Filename
    1362351