• DocumentCode
    2008650
  • Title

    PbBi/sub 2/Te/sub 4/ and PbBi/sub 4/Te/sub 7/, thermoelectric materials in the system of Pb-Bi-Te

  • Author

    Oosawa, Y. ; Tateno, Y. ; Mukaida, M. ; Tsunoda, T. ; Imai, Y. ; Isoda, Y. ; Nishida, I.A.

  • Author_Institution
    Nat. Inst. of Mater. & Chem. Res., Ibaraki, Japan
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    550
  • Lastpage
    553
  • Abstract
    In order to develop new high performance thermoelectric refrigeration materials, attempt of synthesizing new ternary compounds in M-Bi-Te (M=Zn, Cd, Hg, Ga, In, Ti, V, Nb, Ta, Fe, Ni) systems and evaluation of thermoelectric properties of PbBi/sub 2/Te/sub 4/ and PbBi/sub 4/Te/sub 7/ have been carried out. At first, synthesis of new ternary compounds in the M-Bi-Te systems has been attempted. However, no new ternary chalcogenide has been synthesized in these systems in our synthesis conditions. Secondly, the Pb-Bi-Te system has been investigated and the preparation conditions of PbBi/sub 2/Te/sub 4/ and PbBi/sub 4/Te/sub 7/ have been established. Pellets of these compounds have been prepared and the Seebeck coefficient, the electric conductivity, and the thermal conductivity have been measured, and the figure of merit has been calculated.
  • Keywords
    Seebeck effect; bismuth compounds; electrical conductivity; lead compounds; ternary semiconductors; thermal conductivity; thermoelectric conversion; PbBi/sub 2/Te/sub 4/; PbBi/sub 4/Te/sub 7/; Seebeck coefficient; electric conductivity; figure of merit; high performance thermoelectric refrigeration materials; ternary chalcogenide; thermal conductivity; Bismuth; Conducting materials; Inorganic materials; Mercury (metals); Niobium; Refrigeration; Tellurium; Thermal conductivity; Thermoelectricity; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843449
  • Filename
    843449