• DocumentCode
    2011159
  • Title

    Counterfeit electronics: A rising threat in the semiconductor manufacturing industry

  • Author

    Ke Huang ; Carulli, John M. ; Makris, Yiorgos

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2013
  • fDate
    6-13 Sept. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As the supply chain of electronic circuits grows more complex, with parts coming from different suppliers scattered across the globe, counterfeit integrated circuits (ICs) are becoming a serious challenge which calls for immediate solutions. Counterfeiting includes re-labeling legitimate chips or illegitimately replicating chips and deceptively selling them as made by the legitimate manufacturer, or simply selling fake chips. Counterfeiting also includes providing defective parts or simply previously used parts recycled from scrapped assemblies. Obviously, there is a multitude of legal and financial implications involved in such activities and even if these devices initially work, they may have reduced lifetime and may pose reliability risks. In this tutorial, we provide a comprehensive review of existing techniques which seek to prevent and/or detect counterfeit integrated circuits. Various approaches are discussed and an advanced machine learning-based method employing parametric measurements is described in detail.
  • Keywords
    VLSI; circuit analysis computing; integrated circuit manufacture; integrated circuit reliability; learning (artificial intelligence); ICs; VLSI; advanced machine learning-based method; counterfeit electronics; counterfeit integrated circuit detection; electronic circuits; parametric measurements; reliability risks; scrapped assembly; semiconductor manufacturing industry; very large scale integration; Aging; Authentication; Counterfeiting; Integrated circuits; Reliability; Support vector machines; Training;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2013 IEEE International
  • Conference_Location
    Anaheim, CA
  • ISSN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2013.6651880
  • Filename
    6651880