Hybrid fabrication of microfluidic chips based on COC, silicon and TMMF dry resist

We describe the hybrid fabrication of silicon-plastic microfluidic chips based on machining of Cyclic Olefin Copolymer (COC), standard silicon processing and TMMF lithography. The combination of different processes enables an individual material selection leading to significant reduction of the manufacturing costs. We demonstrate the potential of the hybrid technology by manufacturing and testing a 24-channel TopSpot dispenser which consists of an intermediate silicon layer, a COC interface and a TMMF sealing lid. Characterization studies show that TMMF lamination is ideally suited for the sealing of silicon microchannels showing numerous advantages over adhesive-based approaches, thermal and anodic bonding.