DocumentCode
2012090
Title
High yield dense array of very-high-aspect-ratio micro metal posts by photo-electrochemical etching of silicon and electroplating with vacuum degassing
Author
Sun, Guangyi ; Hur, Janet ; Zhao, Xin ; Kim, Chang-Jin C J
Author_Institution
Univ. of California, Los Angeles (UCLA), Los Angeles, CA, USA
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
340
Lastpage
343
Abstract
A high yield fabrication of a dense array of very-high-aspect-ratio (VHAR) freestanding metal posts over a large area is presented. The fabrication is based on photo-electrochemical etching of silicon and bottom-up electroplating of the metal. By using various new techniques, most notably degassing-assisted electroplating, freestanding nickel posts with aspect ratio and height up to 85:1 and 425 ??m, respectively, are realized. While the increase in the aspect ratio of the posts may appear more revealing, the dramatic improvement in yield and uniformity is often more important for applications. The report is over our entire processing area (3 cm2), unlike most others in the literature (1 mm2 - 1 cm2).
Keywords
electroplating; elemental semiconductors; etching; nickel; photoelectrochemistry; silicon; Ni; Si; electroplating; high yield dense array; micrometal posts; nickel posts; photo-electrochemical etching; silicon; vacuum degassing; very-high-aspect-ratio; Batteries; Electrodes; Fabrication; Integrated circuit interconnections; Microelectromechanical systems; Micromechanical devices; Nickel; Silicon; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442497
Filename
5442497
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