• DocumentCode
    2012520
  • Title

    Large scale integrated 3D microfluidic networks through high yield fabrication of vertical vias in PDMS

  • Author

    Carlborg, C.F. ; Haraldsson, K.T. ; Cornaglia, M. ; Stemme, G. ; van der Wijngaart, W.

  • Author_Institution
    KTH - R. Inst. of Technol., Stockholm, Sweden
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    240
  • Lastpage
    243
  • Abstract
    This paper introduces a robust, high yield, single-step fabrication method for creating densely spaced, miniaturized out-of-plane fluidic interconnecting channels (=vias) in standard poly(dimethylsiloxane) PDMS. Unblocked vias are essential for creating 3D microfluidic networks. Previously reported methods either had low yield, because of residual membranes covering the vias after polymerization, or required complicated extra steps to remove the blocking membranes. In contrast, our method prevents the formation of residual membranes by inhibition of the polymerization on top of the protuding mold features defining the vias locations. In addition to providing unblocked vias, the inhibition also leaves a flat partially cured, sticky top surface that adheres well to other surfaces and allows self-sealing stacking of several PDMS layers. We demonstrate the new method by manufacturing a densely perforated PDMS membrane and a large scale integrated (LSI) 3D PDMS microfluidic channel network. Our method enables batch manufacturing of complex fluidic devices by speeding up and simplifying the fabrication of complex microfluidic components in standard PDMS.
  • Keywords
    batch processing (industrial); microfabrication; microfluidics; polymerisation; polymers; 3D polydimethylsiloxane microfluidic channel network; batch manufacturing; blocking membrane removal; complex fluidic devices; fluidic interconnecting channels; large scale integrated 3D microfluidic networks; microfluidic fabrication; perforated polydimethylsiloxane membrane; polymerization inhibition; residual membranes; self-sealing polydimethylsiloxane layer; unblocked vias; vertical vias fabrication; Biomembranes; Bonding; Clamps; Fabrication; Glass; Large scale integration; Mechanical factors; Microfluidics; Platinum; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442520
  • Filename
    5442520