DocumentCode
2012520
Title
Large scale integrated 3D microfluidic networks through high yield fabrication of vertical vias in PDMS
Author
Carlborg, C.F. ; Haraldsson, K.T. ; Cornaglia, M. ; Stemme, G. ; van der Wijngaart, W.
Author_Institution
KTH - R. Inst. of Technol., Stockholm, Sweden
fYear
2010
fDate
24-28 Jan. 2010
Firstpage
240
Lastpage
243
Abstract
This paper introduces a robust, high yield, single-step fabrication method for creating densely spaced, miniaturized out-of-plane fluidic interconnecting channels (=vias) in standard poly(dimethylsiloxane) PDMS. Unblocked vias are essential for creating 3D microfluidic networks. Previously reported methods either had low yield, because of residual membranes covering the vias after polymerization, or required complicated extra steps to remove the blocking membranes. In contrast, our method prevents the formation of residual membranes by inhibition of the polymerization on top of the protuding mold features defining the vias locations. In addition to providing unblocked vias, the inhibition also leaves a flat partially cured, sticky top surface that adheres well to other surfaces and allows self-sealing stacking of several PDMS layers. We demonstrate the new method by manufacturing a densely perforated PDMS membrane and a large scale integrated (LSI) 3D PDMS microfluidic channel network. Our method enables batch manufacturing of complex fluidic devices by speeding up and simplifying the fabrication of complex microfluidic components in standard PDMS.
Keywords
batch processing (industrial); microfabrication; microfluidics; polymerisation; polymers; 3D polydimethylsiloxane microfluidic channel network; batch manufacturing; blocking membrane removal; complex fluidic devices; fluidic interconnecting channels; large scale integrated 3D microfluidic networks; microfluidic fabrication; perforated polydimethylsiloxane membrane; polymerization inhibition; residual membranes; self-sealing polydimethylsiloxane layer; unblocked vias; vertical vias fabrication; Biomembranes; Bonding; Clamps; Fabrication; Glass; Large scale integration; Mechanical factors; Microfluidics; Platinum; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location
Wanchai, Hong Kong
ISSN
1084-6999
Print_ISBN
978-1-4244-5761-8
Electronic_ISBN
1084-6999
Type
conf
DOI
10.1109/MEMSYS.2010.5442520
Filename
5442520
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