Multi-step three dimensional micro assembly for a flexible LED display

Author

Chiou, Yu-Ruei ; Huang, Shih-Ya ; Wang, Kerwin

Author_Institution

Nat. Changhua Univ. of Educ., Changhua, Taiwan

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

59

Lastpage

62

Abstract

This paper presents a novel multi-step three dimensional microassembly of passive-circuit-mesh, conductive beads, and LED chips to fabricate a flexible, bright, and wide viewing angle display. A novel flexible display architecture is proposed. To deliver this design, we focus our efforts on the multi-batch assembly integration. A 3-by-3 light-emitting diode array with a chip size of 610 Â¿m by 610 Â¿m by 90 Â¿m is successfully prototyped with device fill factor up to 37.97%. It yields a 990 Â¿m squared monochromatic pixel.

Keywords

LED displays; microassembling; conductive beads; flexible LED display; flexible display architecture; light-emitting diode array; multibatch assembly integration; multistep three dimensional microassembly; passive-circuit-mesh; squared monochromatic pixel; Aluminum; Assembly; Circuits; Electrodes; Gold; Light emitting diodes; Liquid crystal displays; Packaging; Three dimensional displays; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442567

Filename

5442567