Effects of multipolar magnetic fields of the internal straight antenna in inductively coupled plasma

Summary form only given, as follows. In order to achieve the performance required for high resolution flat panel display (FPD) devices, especially for TFT-LCD of next generation, improved dry etch processes currently indispensable technology for semiconductor industry are required for volume manufacturing and superior critical dimension control. The plasma sources developed to date for the production of high-density and large-area plasmas are mainly focused on the externally planar ICP sources. However, due to their large inductance with the scale-tip to larger areas and the cost and the thickness of its dielectric material, the conventional ICP device using an external spiral antenna has reached its limit in extending the process area.