DocumentCode
2014186
Title
Summary of additional topics from the session on packaging and reliability
Author
Johnson, R. Wayne ; Frank, Randy
Author_Institution
Auburn Univ., AL, USA
fYear
1989
fDate
28-29 Aug 1989
Firstpage
103
Abstract
High-temperature electronics for automotive applications are discussed. It is reported that, by extending existing technology, automotive electronics can be operated at temperatures between 150°C and 200°C. Automotive load dump and its effect on reliability and future automotive electronics development are also discussed. It is stated that the improved efficiency that can be achieved by operating at higher voltage can easily be offset by the increased component costs if the load dump transient is increased by two or four times its present value
Keywords
automotive electronics; packaging; reliability; 150 to 200 degC; automotive electronics; efficiency; load dump; packaging; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Automotive Power Electronics, 1989
Conference_Location
Dearborn, MI
Type
conf
DOI
10.1109/APE.1989.97164
Filename
97164
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