Beyond 2000-Imaging for automated production test of PCB assemblies

The author highlights current applications for imaging and image analysis as used in the printed circuit board (PCB) assembly process and suggests areas of needed improvement in both acquisition and analysis. Imaging is used on PCB assembly lines to meet the demanding placement requirements of the modern components, to identify proper component and orientation, to confirm the proper application of solder paste, to verify soldering, and to test the final assembly. Current imaging techniques from ultrasound, visual, infrared, laser, and X-ray all need to improve to keep up with the demands from the marketplace. The discussion of imaging techniques is restricted to two-dimensional spatial imaging with the third dimension typically representing other information, such as height, temperature, thickness, color, or position. Better price performance is needed for future growth of bond electronics assembly and for vision.<>