• DocumentCode
    2016739
  • Title

    Modeling Job Lifespan Delays in Volunteer Computing Projects

  • Author

    Estrada, Trilce ; Taufer, Michela ; Reed, Kevin

  • Author_Institution
    Univ. of Delaware, Newark, DE
  • fYear
    2009
  • fDate
    18-21 May 2009
  • Firstpage
    331
  • Lastpage
    338
  • Abstract
    Volunteer computing (VC) projects harness the power of computers owned by volunteers across the Internet to perform hundreds of thousands of independent jobs. In VC projects, the path leading from the generation of jobs to the validation of the job results is characterized by delays hidden in the job lifespan, i.e., distribution delay, in-progress delay, and validation delay. These delays are difficult to estimate because of the dynamic behavior and heterogeneity of VC resources. A wrong estimation of these delays can cause the loss of project throughput and job latency in VC projects. In this paper, we evaluate the accuracy of several probabilistic methods to model the upper time bounds of these delays. We show how our selected models predict up-and-down trends in traces from existing VC projects. The use of our models provides valuable insights on selecting project deadlines and taking scheduling decisions. By accurately predicting job lifespan delays, our models lead to more efficient resource use, higher project throughput, and lower job latency in VC projects.
  • Keywords
    Internet; probability; resource allocation; scheduling; Internet; VC project; VC resources; computer power; distribution delay; in-progress delay; job latency; job lifespan delays; probabilistic method; project throughput; resource use; scheduling decision; validation delay; volunteer computing; Character generation; Delay effects; Delay estimation; Grid computing; Internet; Life estimation; Predictive models; Scheduling; Throughput; Virtual colonoscopy; BOINC; modeling lifespan; volunteer computing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Cluster Computing and the Grid, 2009. CCGRID '09. 9th IEEE/ACM International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-3935-5
  • Electronic_ISBN
    978-0-7695-3622-4
  • Type

    conf

  • DOI
    10.1109/CCGRID.2009.69
  • Filename
    5071889