DocumentCode
2017480
Title
Temporary bonding/debonding based on propylene carbonate
Author
Zhu, Zhiyuan ; Du, Hong ; Guan, Yong ; Wang, Hao ; Yu, Min ; Jin, Yufeng ; Zhang, Zhao
Author_Institution
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
158
Lastpage
160
Abstract
This paper carried out extensive research about temporary bonding/debonding schemes based on propylene carbonate (PPC). The temporary bonding was investigated at different bonding temperatures and bonding time. The bonding pressure is 0.2 MPa. The highest shear strength of 4.1 MPa is achieved at bonding temperature of 150°C and bonding time of 20 min. The bonded wafers were debonded using thermal and chemical method.
Keywords
Bonding; ISO Standards; Packaging; Polymers; Silicon; PPC; bonding; debonding; temporary;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236565
Filename
7236565
Link To Document