DocumentCode
2018300
Title
Failure Analysis on Low Pull Strength of Thermo-sonic Wedge Bond between Gold Wire and Gold Substrate of MEMS Device
Author
Thakur, S.K. ; Gan Tai Kwee
Author_Institution
Delphi Automotive Syst., Singapore
fYear
2007
fDate
11-13 July 2007
Abstract
The damaged wire on the wedge resulted in physically thinning of the wire and caused low pull of second bond between gold wire and gold substrate of MEMS component. The thinned wire due to lower cross-section was unable to take high pull force and hence showed poor load sharing with the substrate and hence failed with low pull strength.
Keywords
failure analysis; lead bonding; micromechanical devices; MEMS component; failure analysis; gold substrate; gold wire; low pull strength; thermosonic wedge bond; Diffusion bonding; Failure analysis; Microelectromechanical devices; Micromechanical devices; Microstructure; Scanning electron microscopy; Soldering; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location
Bangalore
Print_ISBN
978-1-4244-1014-9
Type
conf
DOI
10.1109/IPFA.2007.4378106
Filename
4378106
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