• DocumentCode
    2019861
  • Title

    Stretchable copper wires based on reduction of active metallic nanoparticles and electroplating

  • Author

    Zou, Peichao ; Liu, Jingping ; Yang, Cheng

  • Author_Institution
    Division of Energy & Environment, Graduate School at Shenzhen, Tsinghua University, Xili University Town, Nanshan, Shenzhen City, China, 518055
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    550
  • Lastpage
    554
  • Abstract
    Herein we proposed a novel technique in fabricating stretchable copper conductive circuits combining galvanic replacement with Zn-based active paste and electroplating process on elastomeric substrates. The conductive patterns exhibited excellent electrical conductivity and strechability. An active precursor paste composed of zinc nanoparticles and thermal-curable polyurethane resin were used, which was aimed to render the formation of copper layer as the conductive materials by a galvanic replacement reaction. Additionally, electroplating process was employed, with which the as-formed copper layer can be further thickened to improve the electrical conductivity. With this method, a maximal longitudinal tensile elongation of 38.4% was achieved for the wires with negligible conductivity loss. In summary, the flexible copper-based conductive circuits with excellent performances were produced in a cost-effective way. This technology will be a promising candidate for future stretchable electronic applications.
  • Keywords
    Copper; Thermal conductivity; copper; electroplating; galvanic replacement; stretchable circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236647
  • Filename
    7236647