DocumentCode
2020504
Title
A failure analysis on leakage of ceramic capacitor
Author
Cui, Junchao ; Wu, Junming
Author_Institution
Reliability Research and Analysis Center, CEPREI, Guangzhou, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
656
Lastpage
658
Abstract
Failure analysis is a comprehensive process which needs to apply kinds of physical and chemistry methods to find out the mechanism. You must learn as more background information as you can, only then could you choose the applicable methods to study the failure sample avoiding disturbance aroused by analysis methods. In this paper, a print circuit board assembly of TV sets which were exported to South America will be analyzed.
Keywords
Capacitors; Conductivity measurement; Mechanical variables measurement; Resistance; Resistance heating; Surface contamination; SEM&EDS; ceramic capacitor; cross section; leakage; tumor; void;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236671
Filename
7236671
Link To Document