DocumentCode
2021699
Title
A review about the filling of TSV
Author
Chen, Tao ; Sun, Jiadong ; Yan, Riming
Author_Institution
State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, Central South University, Changsha, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
860
Lastpage
865
Abstract
3D integration with TSV is considered to be the development trend of the electronics packaging industry. It can meet the demand of high integration density, high performance and so on. The latest research can be divided into two directions to achieve a high-speed via filling without defect. One is about the process research and optimization of copper electroplating, which addresses the current density, additives and other factors. Another is about exploration of novel filling method. All the studies are aimed to achieve a robust filling result effectively. The recent studies and latest developments of TSV filling is reviewed in this paper.
Keywords
Acceleration; Commercialization; Copper; Filling; Plating; Three-dimensional displays; TSV; copper electroplating; novel filling methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236716
Filename
7236716
Link To Document