DocumentCode
2022015
Title
Degradation mechanisms of solder joints on printed circuit boards during storage determined by infrared multi-point temperature measurements
Author
Kong, Lingchao ; Zheng, Zhen ; An, Rong ; Li, Hailong ; Fu, Mingliang ; Tian, Yanhong ; Wang, Chunqing ; An, Rong ; Wang, Chunqing
Author_Institution
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
911
Lastpage
914
Abstract
In this study, microstructure evolution at intermetallic interfaces in solder joints on printed circuit boards during storage was investigated at various aging temperatures, and compared with the nondestructive infrared temperature measurements and electrical resistance measurements. Results show that the defects and microstructure evolution of solder joints were identified effectively via infrared multi-point temperature measurements. However, electrical properties have no obvious change in the solder joints.
Keywords
Gold; Reliability; Temperature measurement; accelerated storage; degradation mechanism; infrared measurements; solder joints;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236727
Filename
7236727
Link To Document