Advanced multi chip module solutions for RF and digital space applications: status and perspective

The evolution of space modules and equipment hardware is strictly related to the progress of enabling technologies in terms of available high reliable processes and devices, advanced interconnection and packaging techniques and high repeatability production systems. The evolution towards highly integrated microwave and digital hybrids implies an integrate study of electrical, thermal and mechanical properties and proper power dissipation and thermal management techniques. The paper goes through the last solutions conceived and applied by Alenia Spazio in its broad product portfolio for telecommunication, radar and scientific space electronics application.