Thermal analysis of high power LED array system

It´s proved that the physical meaning of the electrical average temperature rise of series LED array system tested by electrical temperature sensitive parameter (TSP) method is the arithmetic mean of the temperature rises of all sub-LEDs in the system. Based on this relationship, a novel method to evaluate the temperature distribution of series LED systems by scan measurement and recursive calculation is proposed in this paper. Transient heating response measurements of GaN based high power LED arrays are presented to provide experimental verification for this method. The results show that this method is real-time valid and package form independent. The error between the results of individual measurement and this proposed method is less than ±2°C.