MEMS gyro sensor using flexible substrate for package size reduction

The applications of gyro sensor modules have been limited due the size and weight of existing MEMs gyro packages on the market. Therefore, the size and weight of gyro sensor modules must be reduced for applications in small, portable devices. It is achieved by incorporating HDI multi-layer flexible substrate with increased circuit density and number via interconnects. In this study, the MEMS gyro package is successfully redesigned and simplified, resulting in a volumetric reduction of approximately 55%. The ceramic enclosure of the current gyro package is replaced by a 2ML flexible substrate and a metallic lid. A series of functional and reliability tests is set up to testify the concept of applying flexible circuit in MEMs packages and the outcome is positive. This lays a strong foundation for the application of flexible substrate in the future MEMs gyro package design and this takes it to the next level where it can be used in a larger variety of electronic devices.