DocumentCode
2026322
Title
Molding process with high alignment precision for the LIGA technology
Author
Both, A. ; Bacher, W. ; Heckele, M. ; Muller, K.D. ; Ruprecht, R. ; Strohrmann, M.
fYear
1995
fDate
29 Jan-2 Feb 1995
Firstpage
186
Keywords
Acceleration; CMOS technology; Geometry; Heating; Integrated circuit technology; Microscopy; Microstructure; Stability; Substrates; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1995, MEMS '95, Proceedings. IEEE
Print_ISBN
0-7803-2503-6
Type
conf
DOI
10.1109/MEMSYS.1995.472582
Filename
472582
Link To Document