DocumentCode
2027736
Title
Millimeter-wave MMIC interconnects using electromagnetic field coupling
Author
Strauss, Georg ; Menzel, Wolfgang
Author_Institution
Dept. of Microwave Techniques, Ulm Univ., Germany
fYear
1994
fDate
2-4 Nov 1994
Firstpage
142
Lastpage
144
Abstract
Standard interconnect and packaging techniques for MMICs tend to get more and more difficult at mm-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling. First theoretical and experimental results are presented in this contribution
Keywords
MIMIC; MMIC interconnects; discontinuities; electromagnetic field coupling; hermetic sealing; millimeter-wave MMIC; packaging techniques; substrate plane transmission lines; tolerances; Coplanar transmission lines; Electromagnetic coupling; Electromagnetic fields; Frequency; Gallium arsenide; Integrated circuit interconnections; MMICs; Microstrip; Packaging; Transmission line theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594115
Filename
594115
Link To Document