Package technology for STM-16 optical Tx/Rx and IC´s

Author

Takai, A. ; Kamada, C. ; Hatta, Y. ; Aoki, S. ; Murata, A. ; Nagano, K.

Author_Institution

Hitachi Ltd., Tokyo, Japan

fYear

1991

fDate

11-16 May 1991

Firstpage

141

Lastpage

146

Abstract

Package technology for STM-16 (2.5 Gbit/s) optical transmitters and receivers is discussed. To obtain high performance and reliability of a laser diode (LD) module, an IC chip, and an LD are assembled contiguously in a non-epoxy hermetically sealed housing separating an epoxy-made optical isolator by a glass window. The LD and a fiber are coupled using laser welding and RF induction heat soldering. To obtain a small degradation caused at the receiver side, ICs are designed to have well-matched characteristics and a flat response. A transmission experiment using modules and ICs developed with these technologies proves their practicality

Keywords

modules; optical communication equipment; optical couplers; packaging; receivers; semiconductor junction lasers; 2.5 Gbit/s; IC chip; RF induction heat soldering; STM-16; flat response; glass window; hermetically sealed housing; laser diode modules; laser welding; optical isolator; optical receivers; optical transmitters; package technology; performance; reliability; transmission experiment; well-matched characteristics; Assembly; Diode lasers; Glass; Hermetic seals; Isolation technology; Isolators; Optical receivers; Optical transmitters; Packaging; Photonic integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163866

Filename

163866