Improvements of inorganic-organic hybrid polymers as dielectric and passivation material

Material innovation is one of the key enablers in order to produce improved, high performance microelectronic devices with enhanced reliability. Polyimides, cyclobutenes and epoxy-based materials are widely spread to be applied as polymer films for electronic packing, interlayer dielectrics, underfillers and passivation materials. However, requirements on materials continuously increase due to miniaturization of electronic devices, their use in harsh conditions and their employment of novel manufacturing and assembly techniques. In order to meet the more demanding specifications, inorganic-organic hybrid polymers offer a tremendous opportunity since they can be tuned to both, their intrinsic material properties and their capability to be processed by numerous process and patterning techniques.