Effect of thermomechanical fatigue on drop impact properties of Sn-Ag-Cu lead-free solder joints

Author

Kobayashi, Takehiko ; Terashima, S. ; Tanaka, Mitsuru

Author_Institution

Adv. Technol. Res. Labs., Nippon Steel & Sumitomo Metal Corp., Futtsu, Japan

fYear

2012

fDate

5-7 Dec. 2012

Firstpage

215

Lastpage

218

Abstract

Drop impact property after the solder joints were subjected to thermomechanical fatigue stresses were investigated. The solder compositions were SAC105 (Sn-1Ag-0.5Cu), SAC305 (Sn-3Ag-0.5Cu), and LF210N (Sn-2Ag-1Cu-0.05Ni) and the temperature range of the thermomechanical fatigue was from -45 degree of centigrade to +125 degree of centigrade. After 200 cycles of thermomechanical treatment, the drop property of SAC105 and SAC305 is almost the same low level whereas the drop property of LF210N keeps as-reflowed level. Microstructural observation revealed the difference of the fracture mode in these three solder compositions.

Keywords

copper alloys; fatigue testing; silver alloys; solders; thermomechanical treatment; tin alloys; LF210N; SAC105 drop property; SAC305 drop property; Sn-Ag-Cu; drop impact properties; lead-free solder joints; microstructural observation; solder compositions; thermomechanical fatigue stresses; thermomechanical treatment; Fatigue; Microstructure; Reliability; Soldering; Stress; Testing; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th

Conference_Location

Singapore

Print_ISBN

978-1-4673-4553-8

Electronic_ISBN

978-1-4673-4551-4

Type

conf

DOI

10.1109/EPTC.2012.6507081

Filename

6507081