DocumentCode
2033515
Title
Enabling Facility Re-Use for 300mm Semiconductor Manufacturing via Integration of Automated Material Handling System and Facility Design
Author
Seall, Steve ; Steele, Douglas C. ; Jung, Melvin
Author_Institution
Intel Corp., Chandler, AZ
fYear
2006
fDate
22-24 May 2006
Firstpage
255
Lastpage
258
Abstract
This paper describes issues faced by Intel during planning for its first conversion of an existing high volume 200mm semiconductor factory to manufacturing on 300mm wafers. A summary of the constraints and challenges, analysis of alternatives, and description of the adopted solution for modifying AMHS and facility design to allow re-use of an existing 200mm semiconductor fab for manufacturing semiconductors on 300mm wafers is discussed
Keywords
electronics industry; facilities planning; materials handling; production facilities; 300 mm; automated material handling system; facility design; semiconductor factory; semiconductor manufacturing; wafers; Floors; Manufacturing automation; Material storage; Materials handling; Production facilities; Pulp manufacturing; Semiconductor device manufacture; Semiconductor materials; Storage automation; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2006. ASMC 2006. The 17th Annual SEMI/IEEE
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
1-4244-0254-9
Type
conf
DOI
10.1109/ASMC.2006.1638764
Filename
1638764
Link To Document